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Introduction to the characteristics of glass packaging


High power LED glass metal package mainly involves optical, thermal, electrical, structure and process, as shown in Figure 1. These factors are independent of each other, and influence each other. Among them, the light is LED package, heat is the hub, electricity, structure and technology is the means, and the function is embodied with the package the level.
The process compatibility and reduce the production cost, LED packaging design and chip design should be carried out at the same time, the chip design should take into account the package structure and process. Otherwise, such as chip manufacturing is completed, probably because the package needs to adjust the structure of the chip, so as to prolong the development cycle of products and process cost, and sometimes not may.
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